PDF⋙ Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing by Sheng Liu, Yong Liu
Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing by Sheng Liu, Yong Liu
Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing by Sheng Liu, Yong Liu PDF, ePub eBook D0wnl0ad
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter.- Models and simulates numerous processes in manufacturing, reliability and testing for the first time
- Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing
- Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products
- Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects
- Appendix and color images available for download from the book's companion website
Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource.
Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
From reader reviews:
Dolores Parker:
This book untitled Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing to be one of several books that will best seller in this year, honestly, that is because when you read this e-book you can get a lot of benefit onto it. You will easily to buy this particular book in the book retail outlet or you can order it by means of online. The publisher of this book sells the e-book too. It makes you quickly to read this book, because you can read this book in your Mobile phone. So there is no reason to you to past this publication from your list.
Robert Hatch:
Spent a free time and energy to be fun activity to complete! A lot of people spent their free time with their family, or their very own friends. Usually they performing activity like watching television, about to beach, or picnic from the park. They actually doing same every week. Do you feel it? Would you like to something different to fill your own free time/ holiday? Might be reading a book may be option to fill your free time/ holiday. The first thing that you ask may be what kinds of reserve that you should read. If you want to consider look for book, may be the reserve untitled Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing can be fine book to read. May be it might be best activity to you.
Tamiko Harmon:
In this age globalization it is important to someone to get information. The information will make someone to understand the condition of the world. The condition of the world makes the information simpler to share. You can find a lot of personal references to get information example: internet, magazine, book, and soon. You can view that now, a lot of publisher in which print many kinds of book. Typically the book that recommended to you is Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing this reserve consist a lot of the information in the condition of this world now. That book was represented how can the world has grown up. The terminology styles that writer value to explain it is easy to understand. The actual writer made some exploration when he makes this book. Here is why this book appropriate all of you.
Read Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing by Sheng Liu, Yong Liu for online ebook
Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing by Sheng Liu, Yong Liu Free PDF d0wnl0ad, audio books, books to read, good books to read, cheap books, good books, online books, books online, book reviews epub, read books online, books to read online, online library, greatbooks to read, PDF best books to read, top books to read Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing by Sheng Liu, Yong Liu books to read online.
Comments
Post a Comment